Is it difficult to dissipate heat from IGBT? New TEC thermoelectric cooling solutions are gradually replacing traditional cooling solutions
Hello everyone, today we will mainly talk about a very critical but easily overlooked topic in the new energy field: the heat dissipation problem of IGBT modules. The "Made in China 2025" issued by the State Council clearly pointed out: "We must promote the development of new energy, smart grids and other fields, and make breakthroughs in key technologies such as high-power power electronic devices." As a core component of a variety of power electronic equipment such as photovoltaic inverters, electric vehicle electronic control systems, and industrial power supplies, the performance of IGBT (insulated gate bipolar transistor) depends to a large extent on how well it dissipates heat. So what are the mainstream heat dissipation methods for IGBT modules at present? Is there a better alternative? Let’s continue looking down.
▲IGBT (Insulated Gate Bipolar Transistor)
What are the traditional IGBT heat dissipation methods?
1. Natural cooling
For low-power IGBT modules, natural cooling is a common heat dissipation method. This method usually increases the surface area to improve heat dissipation efficiency by installing aluminum or copper heat sinks, and relies on natural air convection and thermal radiation from the module surface to release heat directly into the surrounding environment. However, this heat dissipation method has low efficiency and is greatly affected by ambient temperature, so it is not suitable for application requirements of high-power IGBT modules.
2. Forced air cooling
For higher power IGBT modules, we often use forced air cooling. That is, a fan is installed on the basis of the heat sink to enhance convective heat exchange by accelerating air flow. However, this heat dissipation method easily leads to dust accumulation, affects the heat dissipation efficiency, and has limited heat dissipation capacity for local hot spots.
3. Liquid cooling and heat pipe cooling
Some special IGBT power modules require liquid cooling or heat pipes for heat dissipation. However, this method takes up a lot of space and is not suitable for compact photovoltaic inverters. In addition, the liquid cooling system has the risk of leakage, which may cause damage to the module and affect the overall operational safety.
Although these traditional heat dissipation methods have their own advantages, they cannot simultaneously meet the requirements of IGBT high power, high performance and small space design.
New Generation IGBT Cooling Method - Thermoelectric Cooling System
Since traditional heat dissipation methods have application limitations, is there a more ideal alternative? The answer is yes - integrated TEC thermoelectric cooling system is becoming a popular choice for the new generation of IGBT heat dissipation. The core of this system is the thermoelectric cooling module (TEC), which is placed under the IGBT chip to absorb the generated heat in the first place. The heat is then conducted layer by layer through the heat conductor and phase change material, and is finally efficiently discharged to the external environment. No compressor or fan is required during the entire process, and there is no liquid involved. It has a compact structure and high reliability.
▲ IGBT module integrated TEC cooling system
1-IGBT power module chip; 2-TEC; 3-phase change material; 4-heat sink
1. Highly integrated design
The combination of TEC modules and phase change materials achieves an efficient heat dissipation path in a limited space, which is in line with the current trend of miniaturization of IGBTs;
2. Multiple modules share the thermal conductive layer
When the area of the phase change material is large, multiple TEC modules can be arranged on the same heat conductor to form an array heat dissipation structure to further save space.
3. More flexible configuration
The TEC module can be divided into multiple independent areas and activated as needed. This allows for flexible regulation based on actual load conditions, taking into account both energy saving and performance requirements.
The difference between TEC cooling and traditional cooling methods
Traditional heat dissipation methods (represented by air cooling) can no longer meet the growing high-performance demands in terms of efficiency, volume and noise. As thermoelectric cooling technology continues to mature, integrated TEC cooling, as an emerging cooling solution for IGBT, is becoming the first choice of more and more users due to its advantages such as precise temperature control, compact structure and no noise.
In the future, FerroTec will continue to expand TEC technology and product forms to provide more innovative possibilities for IGBT heat dissipation. If you are working in the fields of new energy, power electronics or automation, welcome to follow us and explore new directions in thermal management together.
