At this exhibition, FerroTec focused on showcasing its TEC micro-cooling products, which are developed using high-performance thermoelectric materials and advanced manufacturing processes. These products are widely used in optical communications applications such as lasers, optical receivers, pump sources, and AI data centers (400G DR4, 400G FR4, 800G DR8, 800G FR8, 800G 2xDR4, 800G 2xFR4, and 1.6T). These products offer high reliability and low power consumption, meeting non-hermetic packaging requirements.

At this exhibition, FerroTec showcased a wide range of cooling units, encompassing a variety of designs, including air-cooled, liquid-cooled, and direct-contact. These products offer excellent heat dissipation and efficient cooling capabilities, meeting the wide temperature range requirements of both commercial and industrial applications. They are widely used in cooling and heating scenarios in the medical, scientific research, testing, semiconductor, and other fields.

At this exhibition, FerroTec launched a new generation of high and low temperature cycle test solutions for optical modules. Using a thermoelectric TEC temperature control design, it can achieve rapid temperature rise and fall from -15 to 85°C within 120 seconds, with a temperature control accuracy of ±0.05°C, a cooling capacity of 40W, and a heating capacity of 80W. It is widely used in temperature cycle testing of optical modules of 1.6T and below, and supports OSFPDD, OSFP, OSFP112, QSFP56 and other package types.

It adopts the international standard 19-inch appearance design and TEC thermoelectric cooling technology, which can achieve high-precision temperature control of up to ±0.01°C. The cooling capacity of a single unit can reach 1000W, and the temperature range is 10~60°C. When used with an optical module temperature tester, it can realize multi-channel temperature cycle testing and is widely used in optical communications and semiconductor fields.