I. DBC Substrate: Balancing Cost, Performance, and Process

DBC substrates utilize direct copper-clad ceramic technology, which involves firmly sintering copper foil with a ceramic substrate (such as alumina, Al₂O₃) at high temperatures, resulting in excellent thermal conductivity, insulation, and structural stability. Due to its mature technology and moderate cost, DBC substrates are widely used in consumer electronics such as refrigerators, dehumidifiers, and mobile phone cooling back clips, making them an ideal choice that balances performance and economy.

1. Low cost: The material and manufacturing costs are relatively low, resulting in a high cost-performance ratio and making it suitable for large-scale applications.

2. Mature technology: The preparation process is simple and stable, making it easy to achieve large-scale production.

3. Strong current carrying capacity: The thick copper layer can carry currents from several amps to tens of amps, meeting the needs of high current drive.

4. Excellent heat dissipation performance: Equipped with a high thermal conductivity ceramic substrate, it effectively conducts heat and meets the heat dissipation requirements of most consumer products.

II. DPC substrate: High thermal conductivity and high cost

The manufacturing of DPC substrates combines thin-film processing with photolithography: first, a metal seed layer is sputtered onto the ceramic surface, and then electroplating is used to thicken it to form fine circuits. Although the process involves multiple steps such as vacuum deposition, photolithography, and electroplating, the technical threshold is high, the equipment investment is large, and the overall cost is higher than that of DBC substrates, but due to its high precision and high reliability, DPC substrates are widely used in high-end fields such as temperature control of optical communication lasers and medical equipment, which have high requirements for temperature control accuracy and device size, making them an ideal choice for heat dissipation in precision electronic equipment.

1. Complex process: The process involves multiple steps such as vacuum coating, photolithography, and electroplating, which has a high technical threshold.

2. Higher cost: Due to the large investment in equipment and the complex process, the overall manufacturing cost is usually higher than that of DBC substrates.

3. High-precision wiring: The line width and spacing can reach 10-50μm, the line flatness is excellent, and it supports high-density wiring and miniaturized TEC design.

4. Excellent thermal conductivity: When AlN ceramics (thermal conductivity around 180 W/m·K) are used, the thermal conductivity is excellent.

III. Bonding substrate: Designed for harsh working conditions

The bonding substrate is a special structural substrate designed for harsh environments. It uses an elastic adhesive layer to bond ceramic and copper conductors, effectively buffering thermal stress and improving the stability and durability of the TEC under complex conditions such as high temperature, high humidity, and vibration. It is primarily suitable for fields such as medical equipment where long-term stability, fatigue resistance, and product lifespan are extremely important. It significantly reduces the risk of cracking or failure caused by thermal expansion and contraction, ensuring long-term stable operation of the device.

1. Special buffer structure: The ceramic sheet and the copper guide plate are bonded together with a special elastic adhesive, rather than being directly welded.

2. Strong resistance to thermal stress: TEC (Dielectric Temperature Coefficient) experiences stress due to thermal expansion and contraction during repeated heating and cooling cycles. The elastic adhesive layer effectively absorbs and buffers this stress, significantly reducing the risk of substrate and chip cracking and greatly extending service life.

3. Process and cost: The low level of automation requires manual pasting, resulting in high labor costs.

4. High reliability: In stringent reliability tests such as high temperature and high humidity storage and temperature cycling, the performance of the bonded substrate is far superior to that of the traditional rigid connection substrate.

IV. Metal Substrates: Low Cost and Lightweight

Metal substrates consist of a three-layer structure: a metal base, an insulating layer, and conductive copper foil. They offer advantages such as light weight, easy processing, and low cost. Although their thermal conductivity is not as good as ceramic substrates, it is sufficient for most conventional heat dissipation needs. They are particularly suitable for applications with low heat dissipation requirements, a focus on lightweight design, and cost control.

1. Low cost: Mainly divided into two categories: aluminum substrate and copper substrate. Aluminum substrate has a lower cost and is more economical; for the same volume, copper substrate is more expensive, but has better thermal conductivity. The cost of these two materials is lower than other substrates.

2. Easy to process: It has good machinability, is easy to cut and stamp, and is suitable for mass production.

3. Surface is easily damaged: Aluminum and copper are relatively soft materials, and are easily scratched or bumped during processing and handling.

4. Limited electrical insulation: The dielectric strength of the insulation layer is lower than that of the ceramic substrate, making it unsuitable for high-voltage or high-reliability applications.

5. Ultra-lightweight: For the same area, the metal substrate is lighter than the other substrates mentioned above.

☑️Pursuing value for money

DBC substrates are recommended: they offer moderate cost, mature technology, and stable performance, achieving the best balance between cost, performance, and manufacturability.

☑️High requirements for circuit precision and miniaturization

DPC substrates are recommended: line width and spacing can reach 10~50μm, surface is flat, supports high-density wiring, and is suitable for high-precision, miniaturized TEC designs.

☑️Coping with extreme operating conditions and frequent temperature cycles

☑️Requires low thermal conductivity, with a focus on lightweight design and cost control.

As a leading global supplier of semiconductor cooling devices, FerroTec provides high-performance semiconductor cooling chips, with customizable power, materials, and appearance. For product details and solutions, please contact us at 0571-89712612.